Removing polysilicon

ABSTRACT

Methods include exposing polysilicon to an aqueous composition comprising nitric acid, poly-carboxylic acid and ammonium fluoride, and removing a portion of the polysilicon selective to an oxide using the aqueous composition.

RELATED APPLICATIONS

This Application is a Continuation of U.S. application Ser. No.14/672,870, titled “COMPOSITIONS FOR ETCHING POLYSILICON,” filed Mar.30, 2015 (Allowed), which is a Divisional of U.S. application Ser. No.13/624,272, titled “ETCHING POLYSILICON,” filed Sep. 21, 2012, now U.S.Pat. No. 9,012,318 issued on Apr. 21, 2015 which are commonly assignedand incorporated herein by reference.

TECHNICAL FIELD

The present disclosure relates generally to etching of polysilicon and,in particular, in one or more embodiments, the present disclosurerelates to methods for recessing doped polysilicon in integrated circuitdevice structures, compositions used to perform such methods, andapparatus formed thereby.

BACKGROUND

Memory devices are typically provided as internal, semiconductor,integrated circuit devices in computers or other electronic devices.There are many different types of memory including random-access memory(RAM), read only memory (ROM), dynamic random access memory (DRAM),synchronous dynamic random access memory (SDRAM), and flash memory.

Flash memory devices have developed into a popular source ofnon-volatile memory for a wide range of electronic applications. Flashmemory devices typically use a one-transistor memory cell that allowsfor high memory densities, high reliability, and low power consumption.Changes in threshold voltage of the memory cells, through programming(which is often referred to as writing) of data-storage structures,using charge-storage structures (e.g., floating gates or charge traps)or other physical phenomena (e.g., phase change or polarization),determine the data state of each cell. Common uses for flash memoryinclude personal computers, personal digital assistants (PDAs), digitalcameras, digital media players, cellular telephones, solid state drivesand removable memory modules, and the uses are growing.

There is a continuing desire to increase memory density, e.g., thenumber of bits of data that can be stored for a given integrated circuitdie area. However, as memory density increases, the device structuresoften become smaller, and fabrication of these structures becomes morecritical. For example, device structures are often formed by depositinglayers of materials of different compositions, and selectively removingportions of these layers, such as by isotropic or anisotropic removaltechniques. As these structures become smaller, selectivity of theremoval technique, i.e., the ability to remove one material whilemaintaining the integrity of adjacent, dissimilar materials, becomesmore important.

For the reasons stated above, and for other reasons stated below whichwill become apparent to those skilled in the art upon reading andunderstanding the present specification, there is a need in the art foralternative methods for facilitating improvements in formation ofstructures for integrated circuit devices.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a simplified block diagram of a memory device in communicationwith a processor as part of an electronic system, according to anembodiment.

FIG. 2 is a schematic of an array of memory cells in accordance with anembodiment.

FIGS. 3A-3C are cross-sectional views of a portion of an integratedcircuit device during various stages of fabrication in accordance withan embodiment.

FIG. 4 is a cross-sectional view of a portion of a NAND string of memorycells, in accordance with an embodiment, formed from a structure of thetype depicted in FIG. 3C.

FIGS. 5A-5C are cross-sectional views of a portion of an integratedcircuit device during various stages of fabrication in accordance withan embodiment.

FIG. 6A is a SEM picture of a cross-sectional view of a structure of thetype depicted in FIG. 3C formed in accordance with the prior art.

FIG. 6B is a SEM picture of a cross-sectional view of a structure of thetype depicted in FIG. 3C formed in accordance with an embodiment.

DETAILED DESCRIPTION

In the following detailed description, reference is made to theaccompanying drawings that form a part hereof, and in which is shown, byway of illustration, specific embodiments. In the drawings, likereference numerals describe substantially similar components throughoutthe several views. Other embodiments may be utilized and structural,logical, chemical and electrical changes may be made without departingfrom the scope of the present disclosure. The following detaileddescription is, therefore, not to be taken in a limiting sense.

FIG. 1 is a simplified block diagram of a first apparatus in the form ofa memory device 100 in communication with a second apparatus, in theform of a processor 130, as part of a third apparatus, in the form of anelectronic system, according to an embodiment. Some examples ofelectronic systems include computer servers, network devices, personalcomputers, personal digital assistants (PDAs), digital cameras, digitalmedia players, digital recorders, games, appliances, vehicles, wirelessdevices, cellular telephones and the like. The processor 130 may be amemory controller or other external host device.

Memory device 100 includes an array of memory cells 104 logicallyarranged in rows and columns. Memory cells of a logical row aretypically coupled to the same access line (commonly referred to as aword line) while memory cells of a logical column are typicallyselectively coupled to the same data line (commonly referred to as a bitline). A single access line may be associated with more than one logicalrow of memory cells and a single data line may be associated with morethan one logical column. Memory cells (not shown in FIG. 1) of at leasta portion of array of memory cells 104 are formed using methods asdescribed herein.

A row decode circuitry 108 and a column decode circuitry 110 areprovided to decode address signals. Address signals are received anddecoded to access the array of memory cells 104. Memory device 100 alsoincludes input/output (I/O) control circuitry 112 to manage input ofcommands, addresses and data to the memory device 100 as well as outputof data and status information from the memory device 100. An addressregister 114 is in communication with I/O control circuitry 112 and rowdecode circuitry 108 and column decode circuitry 110 to latch theaddress signals prior to decoding. A command register 124 is incommunication with I/O control circuitry 112 and control logic 116 tolatch incoming commands.

Control logic 116 controls access to the array of memory cells 104 inresponse to the commands and generates status information for theexternal processor 130. The control logic 116 is in communication withrow decode circuitry 108 and column decode circuitry 110 to control therow decode circuitry 108 and column decode circuitry 110 in response tothe addresses.

Control logic 116 is also in communication with a cache register 118.Cache register 118 latches data, either incoming or outgoing, asdirected by control logic 116 to temporarily store data while the arrayof memory cells 104 is busy writing or reading, respectively, otherdata. During a write operation, data is passed from the cache register118 to data register 120 for transfer to the array of memory cells 104;then new data is latched in the cache register 118 from the I/O controlcircuitry 112. During a read operation, data is passed from the cacheregister 118 to the I/O control circuitry 112 for output to the externalprocessor 130; then new data is passed from the data register 120 to thecache register 118. A status register 122 is in communication with I/Ocontrol circuitry 112 and control logic 116 to latch the statusinformation for output to the processor 130.

Status register 122 may include a ready/busy register. For example, a1-bit register could be used to indicate whether the memory device 100is busy (e.g., that the memory device 100 is performing an accessoperation) or ready (e.g., that the memory device 100 has completed, oris not performing, an access operation). Thus, reading the statusregister 122, such as by the processor 130 or the control logic 116,could be used to determine whether the memory device 100 is involved inan access operation or not, e.g., whether or not the memory device isready to initiate an access operation. Alternatively, or in addition,the control logic 116 of memory device 100 might provide a ready/busy(R/B#) signal to provide an indication to processor 130 of whether ornot the memory device 100 is involved in an access operation. Forexample, memory devices often provide a pin (e.g., a pin of control link132) that is asserted to a logic low, for example, when the device isinvolved in an access operation and is pulled up to a logic high whenthe device is again available (e.g., not involved in an accessoperation).

Memory device 100 receives control signals at control logic 116 fromprocessor 130 over a control link 132. The control signals may includeat least a chip enable CE#, a command latch enable CLE, an address latchenable ALE, and a write enable WE#. Additional control signals (notshown) may be further received or provided over control link 132depending upon the nature of the memory device 100. Memory device 100receives command signals (which represent commands), address signals(which represent addresses), and data signals (which represent data)from processor 130 over a multiplexed input/output (I/0) bus 134 andoutputs data to processor 130 over I/0 bus 134.

For example, the commands are received over input/output (I/O) pins[7:0] of I/O bus 134 at I/O control circuitry 112 and are written intocommand register 124. The addresses are received over input/output (I/O)pins [7:0] of bus 134 at I/O control circuitry 112 and are written intoaddress register 114. The data are received over input/output (I/O) pins[7:0] for an 8-bit device or input/output (I/O) pins [15:0] for a 16-bitdevice at I/O control circuitry 112 and are written into cache register118. The data are subsequently written into data register 120 forprogramming the array of memory cells 104. For another embodiment, cacheregister 118 may be omitted, and the data are written directly into dataregister 120. Data, e.g., from the array of memory cells 104 or thestatus register 122, are also output over input/output (I/O) pins [7:0]for an 8-bit device or input/output (I/O) pins [15:0] for a 16-bitdevice.

It will be appreciated by those skilled in the art that additionalcircuitry and signals can be provided, and that the electronic system ofFIG. 1 has been simplified. It should be recognized that thefunctionality of the various block components described with referenceto FIG. 1 may not necessarily be segregated to distinct components orcomponent portions of an integrated circuit device. For example, asingle component or component portion of an integrated circuit devicecould be adapted to perform the functionality of more than one blockcomponent of FIG. 1. Alternatively, one or more components or componentportions of an integrated circuit device could be combined to performthe functionality of a single block component of FIG. 1.

Additionally, while specific I/O and command pins are described inaccordance with popular conventions for receipt and output of thevarious signals, it is noted that other combinations or numbers of pinsmay be used in various embodiments.

FIG. 2 is a schematic of an array of memory cells 200, e.g., as aportion of the array of memory cells 104, in accordance with anembodiment. Array of memory cells 200 includes access lines, such asword lines 202 ₀ to 202 _(N), and intersecting data lines, such as bitlines 204 ₀ to 204 _(M). For ease of addressing in the digitalenvironment, the number of word lines 202 and the number of bit lines204 are generally each some power of two, e.g., 256 word lines 202 by4,096 bit lines 204.

Array of memory cells 200 is arranged in rows (each corresponding to aword line 202) and columns (each corresponding to a bit line 204). Eachcolumn may include a string of memory cells 208, such as one of the NANDstrings 206. Each NAND string 206 may be coupled to a common source(SRC) 216 and includes memory cells 208 ₀ to 208 _(N), each located atan intersection of a word line 202 and a bit line 204. The memory cells208, depicted as floating-gate transistors in FIG. 2, representnon-volatile memory cells for storage of data. Memory cells 208 may be,for example, enhancement mode (e.g., n-type) transistors. The memorycells 208 of each NAND string 206 are connected in series, source todrain, between a source select line (SGS) 214 and a drain select line(SGD) 215.

Source select line 214 includes a source select gate 210, e.g., afield-effect transistor (FET), at each intersection between a NANDstring 206 and source select line 214, and drain select line 215includes a drain select gate 212, e.g., a field-effect transistor (FET),at each intersection between a NAND string 206 and drain select line215. In this way, the memory cells 208 of each NAND string 206 areconnected between a source select gate 210 and a drain select gate 212.Arrays of memory cells utilizing more than one select gate at one orboth ends of a NAND string 206 are known. If multiple source selectgates 210 are utilized for a given string of memory cells 206, theycould be coupled in series between the common source 216 and the memorycell 208 ₀ of that string of memory cells 206. If multiple drain selectgates 212 are utilized for a given string of memory cells 206, theycould be coupled in series between the corresponding bit line 204 andthe memory cell 208 _(N) of that string of memory cells 206.

A source of each source select gate 210 is connected to common source216. The drain of each source select gate 210 is connected to the sourceof the memory cell 208 of a corresponding NAND string 206. Therefore,each source select gate 210 selectively couples its corresponding NANDstring 206 to common source 216. A control gate of each source selectgate 210 is connected to source select line 214.

The drain of each drain select gate 212 is connected to the bit line 204for the corresponding NAND string 206. The source of each drain selectgate 212 is connected to the drain of the last memory cell 208 _(N) ofits corresponding NAND string 206. Therefore, each drain select gate 212selectively couples a corresponding NAND string 206 to a correspondingbit line 204. A control gate of each drain select gate 212 is connectedto drain select line 215.

Typical construction of memory cells 208 includes a source 230 and adrain 232, a data-storage structure 234 (e.g., a floating gate, chargetrap, etc.) that can determines a data state of the cell (e.g., throughchanges in threshold voltage), a control gate 236, and a body 238 (e.g.,a semiconductor on which the memory cell 208 is formed), as shown inFIG. 2. Memory cells 208 have their control gates 236 coupled to (and insome cases from) a word line 202. A column of the memory cells 208 is aNAND string 206 or a plurality of NAND strings 206 coupled to a givenbit line 204. A row of the memory cells 208 are memory cells 208commonly coupled to a given word line 202. A row of memory cells 208can, but need not include all memory cells 208 commonly coupled to agiven word line 202. Rows of memory cells 208 often include every othermemory cell 208 commonly coupled to a given word line 202. For example,memory cells 208 commonly coupled to word line 202 _(N) and selectivelycoupled to even bit lines 204 (e.g., bit lines 204 ₀, 204 ₂, 204 ₄,etc.) may be one row of memory cells 208 (e.g., even memory cells) whilememory cells 208 commonly coupled to word line 202 _(N) and selectivelycoupled to odd bit lines 204 (e.g., bit lines 204 ₁, 204 ₃, 204 ₅, etc.)may be another row of memory cells 208 (e.g., odd memory cells).Although bit lines 204 ₃-404 ₅ are not expressly depicted in FIG. 2, itis apparent from the figure that the bit lines 204 of the array ofmemory cells 200 may be numbered consecutively from bit line 204 ₀ tobit line 204 _(M.) Other groupings of memory cells 208 commonly coupledto a given word line 202 may also define a row of memory cells 208.

FIGS. 3A-3C are cross-sectional views of a portion of an integratedcircuit device during various stages of fabrication. The structure ofFIG. 3A depicts a stack of dissimilar materials 350 and 352. For oneembodiment, the material 350 is polysilicon 350, e.g., a boron-dopedpolysilicon, while the material 352 is an oxide 352, e.g., such as asilicon oxide (SiO/SiO₂) or silicon oxynitride (SiO_(x)N_(y)) material.Such materials may be doped or undoped.

For one example, instances of material 350 may be used to form controlgates of memory cells, such as control gates 236 of memory cells 208 ofNAND strings 206 of FIG. 2. Similarly, instances of material 352 may beused to provide isolation between adjacent memory cells 208, such asbetween memory cells 208 ₀ and 208 ₁ of FIG. 2. Formation of thestructure of FIG. 3A could be formed by forming (e.g., depositing) aninstance of material 352 over some base structure (not shown). The basestructure might include a semiconductor that, in some embodiments, maybe comprised of silicon, e.g., monocrystalline silicon, that may beconductively doped, e.g., to have an n-type conductivity, such as an N⁺conductivity. Where the instances of material 352 are used to formcontrol gates of memory cells of a NAND string, it is noted that feweror more instances of material 352 may be formed depending upon thedesired number of memory cells in each NAND string. It is further notedthat the structure of FIG. 3A may depict instances of material 350 andmaterial 352 used to form only a portion of one or more NAND strings.While the disclosure will be discussed with reference to forming memorycells of NAND strings, the compositions disclosed herein are suitablefor formation of other structures, e.g., integrated circuit structurescontaining doped polysilicon.

The structure of FIG. 3A may then be patterned to form openings 354through the instances of material 350 and the instances of material 352as depicted in FIG. 3B. For example, a mask (not shown), e.g., imagingresist, such as photo-resist, may be formed over the structure of FIG.3A and patterned to expose regions of the top instance of material 350,or some overlying material (not shown). The materials below the exposedregions may be subsequently removed, e.g., by isotropic etching, to formopenings 354.

To form the structure of FIG. 3C, portions of material 350 are removed(e.g., recessed). The removal process utilizes a wet chemistry toanisotropically remove portions of material 350 selective to material352, i.e., to remove material 350 at a faster rate than material 352 isremoved, thereby recessing instances of material 350 relative toinstances of material 352. Thus, to remove portions of material 350, thestructure of FIG. 3B is exposed to an aqueous composition configured toetch material 350 selective to material 352. The exposure is generallyfor a period of time that is expected to remove a desired amount of thematerial 350. For example, it may be experimentally or empiricallydetermined that a particular time is needed to recess material 350 by aparticular amount. Ideally then, if the removal process is performed forthe particular time, it would be expected that the instances of material350 would be recessed by the particular amount and damage to surroundinginstances of material 352 or other materials would be mitigated by notsubjecting them to the removal process for an unnecessary amount oftime. Various embodiments may perform the removal process at processingtemperatures in the range of 20° C. to 90° C., and further embodimentsmay perform the removal process at ambient temperatures, e.g., near 25°C.

For the removal process, various embodiments expose the materials 350and 352 to aqueous compositions containing nitric acid (HNO₃) andammonium fluoride (NH₄F) in order to remove portions of polysiliconselective to surrounding oxide. Various further embodiments furtherinclude hydrofluoric acid (HF) and/or a poly-carboxylic acid, such asoxalic acid (H₂C₂O₄), in such compositions. Compositions for use invarious embodiments may contain additional chemical components that donot materially affect the basic and novel properties of the solutionsdisclosed herein. Some examples may include dyes, lubricants,stabilizers, buffers, surfactants, thickening agents, preservatives andantimicrobial agents. Nitric acid is commonly available in a 70 wt %aqueous solution, ammonium fluoride is commonly available in a 40 wt %aqueous solution, hydrofluoric acid is commonly available in a 49 wt %aqueous solution, and oxalic acid is commonly available as an anhydrousor dehydrate solid.

Applicant has found that the water content of the aqueous compositionscontaining nitric acid and ammonium fluoride can be critical in thefabrication of NAND memory. As memory density has increased, materialthicknesses has generally decreased. For example, the instances ofmaterial 350 and material 352, such as in a NAND string of the typedepicted in FIG. 4, might be formed to be on the order of 30 nm thickusing existing fabrication technology. Applicant has found that waterlevels as low as 39% wt % in aqueous solutions of nitric acid andammonium fluoride can lead to delamination between polysilicon and oxideat such thicknesses. Delamination would generally lead to failure ofsuch a NAND string.

Specifically, tests were conducted with aqueous compositions containing500 parts by volume of nitric acid (70 wt %), 10 parts by volume ofammonium fluoride (40 wt %) and 100 parts by volume of distilled water,resulting in a composition containing 60.6 wt % nitric acid, 0.5 wt %ammonium fluoride and 38.9 wt % water; and 200 parts by volume of nitricacid (70 wt %), 10 parts by volume of ammonium fluoride (40 wt %) and100 parts by volume of distilled water, resulting in a compositioncontaining 50.5 wt % nitric acid, 1.1 wt % ammonium fluoride and 48.4 wt% water. In both tests, recessing boron-doped polysilicon in thepresence of silicon oxide, such as in a structure of the type depictedin FIG. 3C, resulted in delamination of instances of the boron-dopedpolysilicon from instances of the silicon oxide. As such, Applicantbelieves that the water content of various embodiments of compositionsdescribed herein should be held to less than 39 wt %, and morepreferably at less than or equal to 35 wt %, to mitigate suchdelamination between polysilicon and oxide materials in integratedcircuit fabrication.

Applicant has further found that the addition of hydrofluoric acid toaqueous compositions described herein can increase the etch rate of thecompositions for etching polysilicon, but can lead to excessiveaggressiveness toward the top of a stack of materials being etched, suchas in a structure of the type depicted in FIG. 3C. Adding oxalic acid orother poly-carboxylic acid to such compositions may tend to reduce thisaggressiveness at the top of the stack.

For some embodiments, aqueous compositions for use in removing portionsof material 350 might contain 65-70 wt % nitric acid, 0.06-0.60 wt %ammonium fluoride, 0.00-0.08 wt % hydrofluoric acid, 0.0-0.4 wt %poly-carboxylic acid, and 28.9-34.9 wt % water. For certain embodiments,aqueous compositions for use in removing portions of material 350 mightcontain 65-70 wt % nitric acid, 0.06-0.60 wt % ammonium fluoride, and29.4-34.9 wt % water. For certain embodiments, aqueous compositions foruse in removing portions of material 350 might contain 69 wt % nitricacid, 0.6 wt % ammonium fluoride, and 30.4 wt % water. For certainembodiments, aqueous compositions for use in removing portions ofmaterial 350 might contain 69 wt % nitric acid, 0.6 wt % ammoniumfluoride, 0.4 wt % poly-carboxylic acid, and 30 wt % water.

A structure of the type depicted in FIG. 3C may be utilized to form aNAND string of memory cells. FIG. 4 is a cross-sectional view of aportion of a NAND string of memory cells, in accordance with anembodiment, formed from a structure of the type depicted in FIG. 3C,wherein material 350 is polysilicon and material 352 is an oxide.Forming a NAND string of memory cells from a structure of the typedepicted in FIG. 3C can be performed in a variety of methods outside thescope of this disclosure, but one example might include forming a firstdielectric 354 (e.g., forming a thermal oxide) over surfaces of material350, forming a second dielectric 356 (e.g., by chemical vapordeposition) over surfaces of material 352 and first dielectric 354,forming data-storage structures 358 over surfaces of second dielectric356 between instances of material 352, forming a third dielectric 360over surfaces of data-storage structures 358 and second dielectric 356,and forming a semiconductor 362 over (e.g., between) surfaces of thirddielectric 360. The third dielectric 360 might function as a gatedielectric. The data-storage structure 358 might function as a floatinggate. The first dielectric 354 and the second dielectric 356 mightcollectively function as an intergate dielectric. The material 350 mightfunction as a control gate. And the semiconductor 362 might function asa channel region. Additional fabrication, such as formation of sourcelines, select gates, data lines, etc., is well known in the art ofintegrated circuit fabrication and will not be described herein. TheNAND string of FIG. 4 is provided simply to demonstrate how thestructure described with reference to FIGS. 3A-3C might be used in theformation of a memory device. Note that where the data-storagestructures 358 are dielectric data-storage structures, one or more ofthe dielectrics 354, 356 and 360 might be eliminated.

Further note that where the data-storage structures 358 of FIG. 4contain polysilicon, data-storage structures 358 might be formed byforming polysilicon on surfaces of second dielectric 356, followed byremoving portions of that polysilicon in a process similar to thatdescribed with respect to FIG. 3C. For example, FIGS. 5A-5C arecross-sectional views of a portion of an integrated circuit deviceduring various stages of fabrication. FIGS. 5A-5C demonstrate howpolysilicon floating gates might be formed for use as data-storagestructures 358. In FIG. 5A, after formation of the second dielectric356, a polysilicon 357 is formed over surfaces of the second dielectric356. For various embodiments, the polysilicon 357 is formed to fill thevoid between surfaces of the second dielectric 356, such as depicted inFIG. 5A. As one example, polysilicon may be formed by chemical vapordeposition. Polysilicon floating gates are generally conductively doped,e.g., having an n-type or p-type conductivity. For example, thepolysilicon 357 may be a boron-doped polysilicon having a p-typeconductivity.

Following formation of the polysilicon 357, portions of the polysilicon357 are removed. The removal process may begin as depicted in FIG. 5B,by forming an opening 359 in the polysilicon 357, and continue untilsufficient polysilicon 357 is removed to form discrete data-storagestructures 358, such as depicted in FIG. 5C. For various embodiments,such removal may be accomplished by exposing the polysilicon 357 to anaqueous composition containing nitric acid and ammonium fluoride inorder to remove portions of polysilicon 357. Various further embodimentsfurther include hydrofluoric acid and/or a poly-carboxylic acid, such asoxalic acid, in such compositions. Compositions for use in variousembodiments may contain additional chemical components that do notmaterially affect the basic and novel properties of the solutionsdisclosed herein. Some examples may include dyes, lubricants,stabilizers, buffers, surfactants, thickening agents, preservatives andantimicrobial agents. The polysilicon 357 may be exposed to the aqueouscomposition containing nitric acid and ammonium fluoride for a period oftime that is expected to remove sufficient portions of polysilicon 357to leave those portions forming data-storage structures 358 adjacentsurfaces of intergate dielectric 356 and between instances of material352 as depicted in FIG. 5C.

FIGS. 6A and 6B are SEM pictures of cross-sectional views of structuresof the type depicted in FIG. 3C. FIG. 6A depicts a structure formedusing a prior-art method using a vapor phase chemistry to recesspolysilicon in the presence of oxide, while FIG. 6B depicts a structureformed using a method in accordance with an embodiment to recesspolysilicon in the presence of oxide. As can be seen in comparison ofFIGS. 6A and 6B, the sections 670 of polysilicon of FIG. 6A exhibitprotrusions or “nubs” while the sections 670 of polysilicon of FIG. 6Bexhibit a smoother appearance. The nubs in the structure of FIG. 6Awould typically be smoothed away using a second cleaning process. Assuch, embodiments as described herein may eliminate a subsequentcleaning process over methods of the prior art.

Although specific embodiments have been illustrated and describedherein, it will be appreciated by those of ordinary skill in the artthat any arrangement that is calculated to achieve the same purpose maybe substituted for the specific embodiments shown. Many adaptations ofthe embodiments will be apparent to those of ordinary skill in the art.Accordingly, this application is intended to cover any adaptations orvariations of the embodiments.

What is claimed is:
 1. A method, comprising: exposing polysilicon to anaqueous composition comprising nitric acid, poly-carboxylic acid andammonium fluoride; and removing a portion of the polysilicon selectiveto an oxide using the aqueous composition.
 2. The method of claim 1,further comprising using the aqueous composition comprising a watercontent of less than or equal to 39 wt %.
 3. The method of claim 1,further comprising using the aqueous composition comprising 65-70 wt %nitric acid and 0.06-0.6 wt % ammonium fluoride.
 4. The method of claim3, further comprising using the aqueous composition comprisingpoly-carboxylic acid at 0.4 wt % or less.
 5. The method of claim 3,further comprising using the aqueous composition further comprisinghydrofluoric acid.
 6. The method of claim 5, further comprising usingthe aqueous composition comprising hydrofluoric acid at 0.08 wt % orless.
 7. The method of claim 5, further comprising using the aqueouscomposition comprising poly-carboxylic acid at 0.4 wt % or less.
 8. Themethod of claim 7, further comprising using the aqueous composition,wherein the poly-carboxylic acid is oxalic acid.
 9. The method of claim1, wherein exposing the polysilicon to the aqueous composition comprisesexposing a boron-doped polysilicon to the aqueous composition.
 10. Themethod of claim 9, wherein removing the portion of the polysiliconselective to the oxide comprises removing a portion of the boron-dopedpolysilicon selective to a silicon oxide or a silicon oxynitride. 11.The method of claim 1, further comprising using the aqueous compositionfurther comprising at least one component selected from a groupconsisting of a dye, a lubricant, a stabilizer, a buffer, a surfactant,a thickening agent, a preservative and an antimicrobial agent.
 12. Amethod, comprising: forming an instance of polysilicon and forming aninstance of oxide; and removing a portion of the instance of polysiliconselective to the instance of oxide; wherein removing the portion of theinstance of polysilicon selective to the instance of oxide comprisesexposing the instance of polysilicon to an aqueous compositioncomprising nitric acid, poly-carboxylic acid and ammonium fluoride,wherein the aqueous composition comprises a water content of less than39 wt %.
 13. The method of claim 12, wherein exposing the instance ofpolysilicon to the aqueous composition further comprises exposing theinstance of polysilicon to the aqueous composition comprising 65-70 wt %nitric acid, 0.06-0.6 wt % ammonium fluoride, and oxalic acid at 0.4 wt% or less.
 14. The method of claim 13, wherein exposing the instance ofpolysilicon to the aqueous composition further comprises exposing theinstance of polysilicon to the aqueous composition further comprisinghydrofluoric acid at 0.08 wt % or less.
 15. The method of claim 12,wherein exposing the instance of polysilicon to the aqueous compositionfurther comprises exposing the instance of polysilicon to the aqueouscomposition consisting essentially of nitric acid, poly-carboxylic acid,ammonium fluoride, and water.
 16. A method, comprising: forming a firstinstance of oxide; forming an instance of polysilicon over the instanceof oxide; forming a second instance of oxide over the instance ofpolysilicon; forming an opening through the second instance of oxide,the instance of polysilicon and the first instance of oxide; exposingthe second instance of oxide, the instance of polysilicon and the firstinstance of oxide to an aqueous composition; and using the aqueouscomposition, recessing the instance of polysilicon relative to the firstinstance of oxide and the second instance of oxide within the opening;wherein the aqueous composition comprises nitric acid, poly-carboxylicacid and ammonium fluoride.
 17. The method of claim 16, furthercomprising using the aqueous composition comprising a water content ofless than or equal to 39 wt %.
 18. The method of claim 17, furthercomprising using the aqueous composition comprising a water content ofless than or equal to 35 wt %.
 19. The method of claim 16, furthercomprising using the aqueous composition comprising 65-70 wt % nitricacid, 0.06-0.6 wt % ammonium fluoride, and poly-carboxylic acid at 0.4wt % or less.
 20. The method of claim 19, further comprising using theaqueous composition, wherein the poly-carboxylic acid is oxalic acid.21. The method of claim 19, further comprising using the aqueouscomposition further comprising hydrofluoric acid.
 22. The method ofclaim 21, further comprising using the aqueous composition comprisinghydrofluoric acid at 0.08 wt % or less.
 23. The method of claim 22,further comprising using the aqueous composition, wherein thepoly-carboxylic acid is oxalic acid.
 24. The method of claim 16, whereinforming the instance of polysilicon comprises forming an instance ofboron-doped polysilicon.
 25. The method of claim 24, wherein forming thesecond instance of oxide comprises forming an instance of a siliconoxide or a silicon oxynitride.